TITLE
TRENDS IN THE DEVELOPMENT AND APPLICABILITY ANALYSIS OF MIL-HDBK-217F AND FIDES METHODOLOGIES FOR RELIABILITY PREDICTION OF ELECTRONIC COMPONENTS
AUTHOR(S)
Zhivko Svetoslavov Velev, Prodan Ivanov Prodanov*
ABSTRACT
This paper examines the current trends in the development and applicability of two of the most widely used methodologies for calculating the failure rate of electronic components – MIL-HDBK-217F and FIDES. A critical analysis of their fundamental models, correction factors (multiplicative, additive, and mixed), the need for analytical and statistical data, as well as the fields of applicability and validation under different technological and operational conditions, is presented. Based on recent publications (2020–2025), both quantitative and qualitative differences in failure rate estimation are highlighted, along with trends toward the combined use of FIDES and PoF (Physics of Failure) approaches. Conclusions are drawn regarding the
validation of the results obtained by applying both methodologies with respect to modern technologies and their potential implementation in the field of power electronics.
DOI
DOWNLOAD
https://unitech.tugab.bg/images/2025/dokladi/2-Electronics%20and%20Sensors/p242_s2_u188_id422.pdf
How to cite this article:
Zhivko Svetoslavov Velev, Prodan Ivanov Prodanov*, TRENDS IN THE DEVELOPMENT AND APPLICABILITY ANALYSIS OF MIL-HDBK-217F AND FIDES METHODOLOGIES FOR RELIABILITY PREDICTION OF ELECTRONIC COMPONENTS, UNITECH – SELECTED PAPERS - 2025